Matthias M. Morak
(Former)
1 - 4 out of 4Page size: 10
Publications / Theses
- 2022
- Published
Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., Dec 2022, In: Microelectronics Reliability. 139, 114799.Research output: Contribution to journal › Article › Research › peer-review
- 2021
- Published
Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers Inc., 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- 2020
- Published
The crucial role of external force in the estimation of the topology freezing transition temperature of vitrimers by elongational creep measurements
Kaiser, S., Novak, P., Giebler, M., Gschwandl, M., Novak, P., Pilz, G., Morak, M. & Schlögl, S., 9 Sept 2020, In: Polymer. 204, 122804.Research output: Contribution to journal › Article › Research › peer-review
- 2019
- Published
Nonlinear material modeling and simulation of thermoplastics
Morak, M. M., 2019Research output: Thesis › Doctoral Thesis
