Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Authors
Organisational units
External Organisational units
- Polymer Competence Center Leoben GmbH
- Austria Technologie Systemtechnik Aktiengesellschaft
- Vitesco Technologies
Details
| Original language | English |
|---|---|
| Title of host publication | 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (electronic) | 9781665413732 |
| ISBN (print) | 9781665413732 |
| DOIs | |
| Publication status | Published - 19 Apr 2021 |
| Event | 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 - St. Julian, Malta Duration: 19 Apr 2021 → 21 Apr 2021 |
Publication series
| Name | 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 |
|---|
Conference
| Conference | 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 |
|---|---|
| Country/Territory | Malta |
| City | St. Julian |
| Period | 19/04/21 → 21/04/21 |
