Microelectronics Reliability, 0026-2714
Journal
| ISSNs | 0026-2714 |
|---|
1 - 6 out of 6Page size: 10
Publications / Theses
- 2022
- Published
Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., Dec 2022, In: Microelectronics Reliability. 139, 114799.Research output: Contribution to journal › Article › Research › peer-review
- 2017
- Published
Influence of cooling rate and annealing on the DSC Tg of an epoxy resin
Tao, Q., Pinter, G. & Krivec, T., 1 Nov 2017, In: Microelectronics Reliability. 78, p. 396-400 5 p.Research output: Contribution to journal › Article › Research › peer-review
- 2016
- Published
Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads
Fellner, K., Antretter, T., Fuchs, P. F. & Tao, Q., 2016, In: Microelectronics Reliability. p. 148-155Research output: Contribution to journal › Article › Research › peer-review
- Published
The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates
Glushko, O., Cordill, M., Klug, A. & List-Kratochvil, E. J. W., 2016, In: Microelectronics Reliability.Research output: Contribution to journal › Article › Research › peer-review
- 2013
- Published
PCB drop test lifetime assessment based on simulations and cyclic bend tests
Fuchs, P., Pinter, G. & Major, Z., 2013, In: Microelectronics Reliability. 53, p. 774-781Research output: Contribution to journal › Article › Research › peer-review
- 2012
- Published
Determination of the orthotropic material properties of individual layers of printed circuit boards
Fuchs, P. F., Pinter, G. & Tonejc, M., 2012, In: Microelectronics Reliability. 52, 11, p. 2723-2730Research output: Contribution to journal › Article › Research › peer-review
