Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics

Research output: Contribution to journalArticleResearchpeer-review

External Organisational units

  • Polymer Competence Center Leoben GmbH
  • AT and S AG
  • Vitesco Technologies

Details

Original languageEnglish
Article number114799
JournalMicroelectronics Reliability
Volume139
DOIs
Publication statusPublished - Dec 2022