Chair of Mechanics (400)

Organisational unit: Chair

Publications / Theses

  1. 2022
  2. Published

    Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., Dec 2022, In: Microelectronics Reliability. 139, 114799.

    Research output: Contribution to journalArticleResearchpeer-review

  3. 2021
  4. Published

    Surface stress of gold nanoparticles revisited

    Holec, D., Löfler, L., Zickler, G., Vollath, D. & Fischer, F-D., 1 Aug 2021, In: International journal of solids and structures. 224.2021, 1 August, p. 1-13 13 p., 111044.

    Research output: Contribution to journalArticleResearchpeer-review

  5. Published

    First-principles calculations to investigate pressure effect on mechanical and thermal properties of ZrAl2

    Tang, M., Rong, Z. C., Li, F. X., Yi, J. H., Eckert, J. & Liu, Y. C., Aug 2021, In: Computational & theoretical chemistry. 1202, 113304.

    Research output: Contribution to journalArticleResearchpeer-review

  6. Published

    First-Principles Study of the Intrinsic Properties of the fcc/hcp-Ti Boundary in Carbon Nanotube/Ti Composites Prepared by High-Pressure Torsion

    Rong, Z., Hao, P., Tang, M., Chen, P., Li, F., Yi, J., Şopu, D., Eckert, J. & Liu, Y., Jul 2021, In: Physica Status Solidi (B) Basic Research. 258, 7, 2100093.

    Research output: Contribution to journalArticleResearchpeer-review

  7. Published
  8. Published

    Evaluation of Cement-Casing & Cement-Rock Bond Integrity during Well Operations.

    Lamik, A., Thonhauser, G., Ravi, K., Prohaska-Marchried, M., Pittino, G. & Antretter, T., 27 May 2021, p. 1-13. 13 p.

    Research output: Contribution to conferencePaperpeer-review

  9. Published

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers Inc., 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  10. Published

    Role of elastic strain energy in spheroidal precipitates revisited

    Böhm, H. J., Zickler, G., Fischer, F-D. & Svoboda, J., Apr 2021, In: Mechanics of materials. 155, April, 6 p., 103781.

    Research output: Contribution to journalArticleResearchpeer-review

  11. Published

    An atomistic view on Oxygen, antisites and vacancies in the γ-TiAl phase

    Razumovskiy, V. I., Ecker, W., Wimler, D., Fischer, F-D., Appel, F., Mayer, S. & Clemens, H., 2021, In: Computational materials science. 2021, 197, p. 1-8

    Research output: Contribution to journalArticleResearchpeer-review

  12. Published
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