Microstructure and stress gradients in TiW thin films characterized by 40 nm X-ray diffraction and transmission electron microscopy

Research output: Contribution to journalArticleResearchpeer-review

Organisational units

External Organisational units

  • Infineon Technologies AG Austria
  • ESRF
  • Kompetenzzentrum Automobil- und Industrieelektronik GmbH
  • Erich Schmid Institute of Materials Science

Details

Original languageEnglish
Article number137576
JournalThin solid films
Volume691
DOIs
Publication statusPublished - 1 Dec 2019