Microstructure and stress gradients in TiW thin films characterized by 40 nm X-ray diffraction and transmission electron microscopy
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In: Thin solid films, Vol. 691, 137576, 01.12.2019.
Research output: Contribution to journal › Article › Research › peer-review
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TY - JOUR
T1 - Microstructure and stress gradients in TiW thin films characterized by 40 nm X-ray diffraction and transmission electron microscopy
AU - Saghaeian, F.
AU - Keckes, J.
AU - Woehlert, S.
AU - Rosenthal, M.
AU - Reisinger, M.
AU - Todt, J.
PY - 2019/12/1
Y1 - 2019/12/1
KW - Internal stress
KW - Residual stress
KW - Thin film
KW - Titanium tungsten, Diffusion barrier
KW - X-ray nanodiffraction
UR - http://www.scopus.com/inward/record.url?scp=85073521309&partnerID=8YFLogxK
U2 - 10.1016/j.tsf.2019.137576
DO - 10.1016/j.tsf.2019.137576
M3 - Article
AN - SCOPUS:85073521309
VL - 691
JO - Thin solid films
JF - Thin solid films
SN - 0040-6090
M1 - 137576
ER -