Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces
Research output: Contribution to journal › Article › Research › peer-review
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Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces. / Kleinbichler, Andreas; Zechner, J.; Cordill, Megan.
In: Microelectronic engineering, Vol. 167, 2017, p. 63-68.
In: Microelectronic engineering, Vol. 167, 2017, p. 63-68.
Research output: Contribution to journal › Article › Research › peer-review
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Kleinbichler, A, Zechner, J & Cordill, M 2017, 'Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces', Microelectronic engineering, vol. 167, pp. 63-68.
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Bibtex - Download
@article{c50d23c1fc99469086876211a14e65e6,
title = "Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces",
author = "Andreas Kleinbichler and J. Zechner and Megan Cordill",
year = "2017",
language = "English",
volume = "167",
pages = "63--68",
journal = "Microelectronic engineering",
issn = "0167-9317",
publisher = "Elsevier",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces
AU - Kleinbichler, Andreas
AU - Zechner, J.
AU - Cordill, Megan
PY - 2017
Y1 - 2017
M3 - Article
VL - 167
SP - 63
EP - 68
JO - Microelectronic engineering
JF - Microelectronic engineering
SN - 0167-9317
ER -
