Microelectronic engineering, 0167-9317
Journal
ISSNs | 0167-9317 |
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1 - 6 out of 6Page size: 10
Publications / Theses
- 2017
- Published
Accelerated thermo-mechanical fatigue of copper metallizations studied by pulsed laser heating
Wurster, S., Bigl, S., Cordill, M. J. & Kiener, D., 5 Jan 2017, In: Microelectronic engineering. 167, p. 110-118 9 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Influence of extreme thermal cycling on metal-polymer interfaces
Putz, B., Völker, B., Semprimoschnig, C. & Cordill, M. J., 5 Jan 2017, In: Microelectronic engineering. 167, p. 17-22 6 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces
Kleinbichler, A., Zechner, J. & Cordill, M., 2017, In: Microelectronic engineering. 167, p. 63-68Research output: Contribution to journal › Article › Research › peer-review
- 2002
- Published
Numerical simulations of magneto transport in dot array systems at high magnetic fields
Oswald, J., Ochiai, Y., Aoki, N., Lin, LH., Ishibashi, K., Aoyagi, Y., Bird, J. P. & Ferry, D. K., 2002, In: Microelectronic engineering. p. 91-95Research output: Contribution to journal › Article › Research › peer-review
- 1999
- Published
A Networkmodel for the Hall Insulator
Oswald, J., Homer, A. & Ganitzer, P., 1999, In: Microelectronic engineering. 47, p. 31-33Research output: Contribution to journal › Article › Research › peer-review
- Published
Separation of Universal and Non-Universal Scaling Regions in the IQHE
Meisels, R., Kuchar, F., Belitsch, W. & Kramer, B., 1999, In: Microelectronic engineering. 47, p. 23-25Research output: Contribution to journal › Article › Research › peer-review