Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces
Research output: Contribution to journal › Article › Research › peer-review
Authors
Organisational units
External Organisational units
- KAI - Kompetenzzentrum Automobil- und Industrieelektronik GmbH
- Erich Schmid Institute of Materials Science
- Infineon Technologies AG Austria
Details
| Original language | English |
|---|---|
| Pages (from-to) | 63-68 |
| Journal | Microelectronic engineering |
| Volume | 167 |
| Publication status | Published - 2017 |
