Qi Tao

(Former)

Publications / Theses

  1. 2022
  2. Published

    Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., Dec 2022, In: Microelectronics Reliability. 139, 114799.

    Research output: Contribution to journalArticleResearchpeer-review

  3. 2021
  4. Published

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers Inc., 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  5. 2019
  6. Published

    Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

    Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 2029-2035 7 p. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  7. 2018
  8. Published

    Model Free Kinetics coupled with Finite Element Method for curing simulation of thermosetting epoxy resins

    Tao, Q., Pinter, G. G., Antretter, T., Krivec, T. & Fuchs, P., 2018, In: Journal of Applied Polymer Science. p. 1-8

    Research output: Contribution to journalArticleResearchpeer-review

  9. Published