Michael Reisinger
(Former)
1 - 6 out of 6Page size: 10
Publications / Theses
- 2019
- Published
Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior
Du, C., Soeler, R., Völker, B., Matoy, K., Zechner, J., Langer, G., Reisinger, M., Todt, J., Kirchlechner, C. & Dehm, G., 1 Dec 2019, In: Materialia. 8, 100503.Research output: Contribution to journal › Article › Research › peer-review
- Published
Microstructure and stress gradients in TiW thin films characterized by 40 nm X-ray diffraction and transmission electron microscopy
Saghaeian, F., Keckes, J., Woehlert, S., Rosenthal, M., Reisinger, M. & Todt, J., 1 Dec 2019, In: Thin solid films. 691, 137576.Research output: Contribution to journal › Article › Research › peer-review
- 2017
- Published
Resolving alternating stress gradients and dislocation densities across AlxGa1-xN multilayer structures on Si(111)
Reisinger, M., Tomberger, M., Zechner, J., Daumiller, I., Sartory, B., Ecker, W., Keckes, J. & Lechner, RT., Oct 2017, In: Applied physics letters. 111, 16, p. 162103 4 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Depth resolved stress gradient and dislocation analyses in III-N multilayer structures
Reisinger, M., 2017Research output: Thesis › Doctoral Thesis
- 2016
- Published
Cross-sectional stress distribution in AlxGa1-xN heterostructure on Si(111) substrate characterized by ion beam layer removal method and precession electron diffraction
Reisinger, M., Zalesak, J., Daniel, R., Tomberger, M., Weiss, J. K., Darbal, A. D., Petrenec, M., Zechner, J., Daumiller, I., Ecker, W., Sartory, B. & Keckes, J., 2016, In: Materials and Design. 106, p. 476-481 6 p.Research output: Contribution to journal › Article › Research › peer-review
- 2014
- Published