Mario Gschwandl
(Former)
1 - 7 out of 7Page size: 10
Publications / Theses
- 2022
- Published
Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., Dec 2022, In: Microelectronics Reliability. 139, 114799.Research output: Contribution to journal › Article › Research › peer-review
- 2021
- Published
Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers Inc., 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- 2020
- Published
A Modeling Framework for Enhanced Reliability of Printed Circuit Boards and Power Electronics
Gschwandl, M., 2020Research output: Thesis › Doctoral Thesis
- 2019
- Published
Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads
Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 2029-2035 7 p. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
A Sequential Finite Volume Method / Finite Element Analysis of a Power Electronic Semiconductor Chip
Gschwandl, M., Fuchs, P. F., Antretter, T., Pfost, M., Mitev, I., Tao, Q., Krivec, T., Schingale, A. & Decker, M., 2019, p. 1509-1514.Research output: Contribution to conference › Paper › peer-review
- 2016
- Published
Data Analytics and Data Mining Methods for Heavy Plant and Machinery
Gschwandl, M., 2016Research output: Thesis › Diploma Thesis
- Published
Finite element analysis of arbitrarily complex electronics devices
Gschwandl, M., Fuchs, P., Fellner, K., Antretter, T., Krivec, T. & Tao, Q., 2016, Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016. p. 497-500Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
