Department Physics, Mechanics and Electrical Engineering

Organisational unit: Departments & Institutes

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Publications / Theses

  1. 2015
  2. Published

    3D numerical study on microwave induced stresses in inhomogeneous hard rocks

    Toifl, M., Meisels, R., Hartlieb, P., Kuchar, F. & Antretter, T., 2015.

    Research output: Contribution to conference › Presentation › Research

  3. Published

    3D numerical study on microwave induced stresses in inhomogeneous hard rocks

    Toifl, M., Meisels, R., Hartlieb, P., Kuchar, F. & Antretter, T., 2015.

    Research output: Contribution to conference › Paper

  4. Published

    AFM and KPFM investigation of high strength aluminium brazing sheets

    Huszar, M., Kremmer, T., Kratzer, M., Oberhauser, P., Antrekowitsch, H. & Teichert, C., 2015.

    Research output: Contribution to conference › Poster › Research

  5. Published

    Analysis of the mobility of migrating austenite–ferrite interfaces

    Gamsjäger, E., Wiessner, M., Schider, S., Chen, H. & van der Zwaag, S., 2015, In: Philosophical magazine. 95:26, p. 2899-2917

    Research output: Contribution to journal › Article › Research › peer-review

  6. Published

    An inverse finite element approach to calculate full-field forming strains

    Ritt, R., Machado, M., Fischlschweiger, M., Major, Z. & Antretter, T., 2015, In: Key engineering materials. 651-653, p. 363 368 p.

    Research output: Contribution to journal › Article › Research › peer-review

  7. Published

    Antenna Pattern Optimization for a RSSI-based Direction of Arrival Localization System

    Hartmann, M., Pfadenhauer, O., Patino-Studencka, L., Troeger, H-M., Heuberger, A. & Thielecke, J., 2015

    Research output: Other contribution › Research

  8. Published

    Charging of calcite(100) surface by contact with mineral particles studied by Kelvin Probe Force Microscopy

    Klima, S., 2015

    Research output: Thesis › Diploma Thesis

  9. Published

    Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process

    Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R. & Antretter, T., 2015, In: Journal of Microelectronics and Electronic Packaging. 12, p. 80-85

    Research output: Contribution to journal › Article › Research › peer-review

  10. Published

    Cyclic mechanical behavior of thin layers of copper: A theoretical and numerical study

    Fellner, K., Antretter, T., Fuchs, P. & Pélisset, T., 2015, In: The Journal of Strain Analysis for Engineering Design. p. 1-9

    Research output: Contribution to journal › Article › Research › peer-review

  11. Published

    Degradation analysis of thin die-attach layer under cyclic thermal load in microelectronics packaging

    Pelisset, T. M. A., 2015

    Research output: Thesis › Doctoral Thesis

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