Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process
Research output: Contribution to journal › Article › Research › peer-review
Authors
Organisational units
External Organisational units
- Materials Center Leoben Forschungs GmbH
- Voestalpine Tubulars
- Schienen GmbH
Details
| Original language | English |
|---|---|
| Pages (from-to) | 80-85 |
| Journal | Journal of Microelectronics and Electronic Packaging |
| Volume | 12 |
| Publication status | Published - 2015 |
