Journal of Microelectronics and Electronic Packaging, ‎1551-4897

Journal

ISSNs1551-4897
1 - 2 out of 2Page size: 10

Publications / Theses

  1. 2016
  2. Published

    Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments

    Bermejo, R., Krautgasser, C., Deluca, M., Pletz, M., Supancic, P., Aldrian, F. & Danzer, R., 2016, In: Journal of Microelectronics and Electronic Packaging. 13, 1, p. 17-22 6 p.

    Research output: Contribution to journal › Article › Research › peer-review

  3. 2015
  4. Published

    Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process

    Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R. & Antretter, T., 2015, In: Journal of Microelectronics and Electronic Packaging. 12, p. 80-85

    Research output: Contribution to journal › Article › Research › peer-review

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