Substrate-influenced thermo-mechanical fatigue of copper metallizations: Limits of Stoney's equation

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Substrate-influenced thermo-mechanical fatigue of copper metallizations: Limits of Stoney's equation. / Bigl, Stephan; Wurster, Stefan; Cordill, Megan J. et al.
In: Materials, Vol. 10, No. 11, 1287, 09.11.2017.

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@article{38d26ddb0cd64b40a0d06db3916a3e88,
title = "Substrate-influenced thermo-mechanical fatigue of copper metallizations: Limits of Stoney's equation",
keywords = "Stress, Thermo-mechanical, Thin films",
author = "Stephan Bigl and Stefan Wurster and Cordill, {Megan J.} and Daniel Kiener",
year = "2017",
month = nov,
day = "9",
doi = "10.3390/ma10111287",
language = "English",
volume = "10",
journal = "Materials",
issn = "1996-1944",
publisher = "Multidisciplinary Digital Publishing Institute (MDPI)",
number = "11",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Substrate-influenced thermo-mechanical fatigue of copper metallizations

T2 - Limits of Stoney's equation

AU - Bigl, Stephan

AU - Wurster, Stefan

AU - Cordill, Megan J.

AU - Kiener, Daniel

PY - 2017/11/9

Y1 - 2017/11/9

KW - Stress

KW - Thermo-mechanical

KW - Thin films

UR - http://www.scopus.com/inward/record.url?scp=85033723779&partnerID=8YFLogxK

U2 - 10.3390/ma10111287

DO - 10.3390/ma10111287

M3 - Article

AN - SCOPUS:85033723779

VL - 10

JO - Materials

JF - Materials

SN - 1996-1944

IS - 11

M1 - 1287

ER -