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2021
Published
Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices
Lassnig, A., Terziyska, V. L., Zalesak, J., Jörg, T., Toebbens, D. M., Griesser, T., Mitterer, C., Pippan, R. & Cordill, M. J., 22 Jan 2021, In: ACS Applied Nano Materials. 4, 1, p. 61-70 10 p.
Research output: Contribution to journal › Article › Research › peer-review
E-pub ahead of print
Improved electro-mechanical reliability of flexible systems with alloyed Mo-Ta adhesion layers
Kreiml, P., Rausch, M., Terziyska, V., Köstenbauer, H., Winkler, J., Mitterer, C. & Cordill, M. J., 9 Jan 2021, (E-pub ahead of print) In: Thin solid films. 720.2021, 28 February, 9 p., 138533.
Research output: Contribution to journal › Article › Research › peer-review
Published
Evolution of the microstructure of sputter deposited TaAlON thin films with increasing oxygen partial pressure
Schalk, N., Saringer, C., Fian, A., Terziyska, V., Julin, J. & Tkadletz, M., 2021, In: Surface & coatings technology. 2021, 418, p. 1-7
Research output: Contribution to journal › Article › Research › peer-review
Published
Microstructural effects on the interfacial adhesion of nanometer- thick Cu films on glass substrates: Implications for microelectronic devices
Lassnig, A., Terziyska, V., Zalesak, J., Jörg, T., Többens, D., Griesser, T., Mitterer, C., Pippan, R. & Cordill, M., 2021, In: ACS Applied Nano Materials. 2021, 4, p. 61-70
Research output: Contribution to journal › Article › Research › peer-review
2020
Published
Molecular coverage determines sliding wear behavior of n ‐ octadecylphosphonic acid functionalized Cu – O coated steel disks against aluminum
Prünte, S., Music, D., Terziyska, V., Mitterer, C. & Schneider, J. M., 2020, In: Materials.
Research output: Contribution to journal › Article › Research › peer-review
2019
Published
Correlation of mechanical damage and electrical behavior of Al/Mo bilayers subjected to bending
Kreiml, P., Rausch, M., Terziyska, V. L., Köstenbauer, H., Winkler, J., Mitterer, C. & Cordill, M. J., 1 Oct 2019, In: Thin solid films. 687, 137480.
Research output: Contribution to journal › Article › Research › peer-review
Published
Thermal stability of immiscible sputter-deposited Cu-Mo thin films
Souli, I., Gruber, G., Terziyska, V., Zechner, J. & Mitterer, C., 30 Apr 2019, In: Journal of alloys and compounds. 793.2019, April, p. 208-218 11 p.
Research output: Contribution to journal › Article › Research › peer-review
Published
Compressive and tensile bending of sputter deposited Al/Mo bilayers
Kreiml, P., Rausch, M., Terziyska, V., Winkler, J., Mitterer, C. & Cordill, M., 15 Mar 2019, In: Scripta materialia. 162.2019, March, p. 367-371 5 p.
Research output: Contribution to journal › Article › Research › peer-review
2018
E-pub ahead of print
Evolution of microstructure and mechanical properties of a grades TiAlON thin film investigated by cross-sectional characterization techniques
Schalk, N., Tkadletz, M., Terziyska, V., Deluca, M., Letofsky-Papst, I., Keckes, J. & Mitterer, C., 14 Dec 2018, (E-pub ahead of print) In: Surface & coatings technology. 315.2019, February, p. 155-161 7 p.
Research output: Contribution to journal › Article › Research › peer-review
Published
Electro-mechanical behavior of Al/Mo bilayers studied with in situ straining methods
Kreiml, P., Rausch, M., Terziyska, V., Köstenbauer, H., Winkler, J., Mitterer, C. & Cordill, M., 2018, In: Thin solid films. p. 131-136
Research output: Contribution to journal › Article › Research › peer-review

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