Microstructural effects on the interfacial adhesion of nanometer- thick Cu films on glass substrates: Implications for microelectronic devices
Research output: Contribution to journal › Article › Research › peer-review
Authors
Organisational units
External Organisational units
- Erich Schmid Institute of Materials Science
- Helmholtz-Zentrum Berlin für Materialien und Energie (HZB)
Details
| Original language | English |
|---|---|
| Pages (from-to) | 61-70 |
| Journal | ACS Applied Nano Materials |
| Volume | 2021 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 2021 |
