Schipfer, C.,
Gschwandl, M.,
Fuchs, P.,
Antretter, T.,
Feuchter, M.,
Morak, M.,
Tao, Q. &
Schingale, A.,
19 Apr 2021,
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers Inc., 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution