Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process
Research output: Contribution to journal › Article › Research › peer-review
Standard
Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process. / Macurova, K.; Bermejo, Raul; Pletz, M. et al.
In: Journal of Microelectronics and Electronic Packaging, Vol. 12, 2015, p. 80-85.
In: Journal of Microelectronics and Electronic Packaging, Vol. 12, 2015, p. 80-85.
Research output: Contribution to journal › Article › Research › peer-review
Harvard
Macurova, K, Bermejo, R, Pletz, M, Schöngrundner, R & Antretter, T 2015, 'Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process', Journal of Microelectronics and Electronic Packaging, vol. 12, pp. 80-85.
APA
Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R., & Antretter, T. (2015). Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process. Journal of Microelectronics and Electronic Packaging, 12, 80-85.
Vancouver
Macurova K, Bermejo R, Pletz M, Schöngrundner R, Antretter T. Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process. Journal of Microelectronics and Electronic Packaging. 2015;12:80-85.
Author
Bibtex - Download
@article{0a119ba759264937a29e8fcb4eb2f284,
title = "Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process",
author = "K. Macurova and Raul Bermejo and M. Pletz and Ronald Sch{\"o}ngrundner and Thomas Antretter",
year = "2015",
language = "English",
volume = "12",
pages = "80--85",
journal = "Journal of Microelectronics and Electronic Packaging",
issn = "1551-4897",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process
AU - Macurova, K.
AU - Bermejo, Raul
AU - Pletz, M.
AU - Schöngrundner, Ronald
AU - Antretter, Thomas
PY - 2015
Y1 - 2015
M3 - Article
VL - 12
SP - 80
EP - 85
JO - Journal of Microelectronics and Electronic Packaging
JF - Journal of Microelectronics and Electronic Packaging
SN - 1551-4897
ER -
