Thomas Antretter
Publications / Theses
- 2014
- Published
Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process
Macurova, K., Bermejo Moratinos, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Jan 2014, Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. p. 355-360 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Characterization and modeling of the AuSnCu thin solder joint under thermal cycling
Pélisset, T., Karunamurthy, B., Otremba, R. & Antretter, T., 2014.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Characterization and modeling of the AuSnCu thin solder joint under thermal cycling
Antretter, T., Otremba, R., Karunamurthy, B. & Pélisset, T., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method
Schöngrundner, R., Treml, R., Antretter, T., Kozic, D., Ecker, W. & Kiener, D., 2014, In: Thin solid films. p. 321-330Research output: Contribution to journal › Article › Research › peer-review
- Published
Determination of cyclic mechanical properties of thin copper layers for PCB applications
Fellner, K., Fuchs, P. F., Antretter, T., Pinter, G. & Schöngrundner, R., 2014, Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. p. 1-8Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method
Kozic, D., Treml, R., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T. & Gänser, H-P., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Zhang, G. Q., Van Driel, W. D., Rodgers, P., Bailey, C. & de Saint Leger, O. (eds.). Institute of Electrical and Electronics Engineers Inc., 6813785Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Festigkeitsskalierung nach Weibull
Pittino, G., Tichy, R., Galler, R., Antretter, T., Ecker, W., Gimpel, M. & Kargl, H., 2014.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Method development for the cyclic characterization of thin copper layers for PCB applications
Fellner, K., Fuchs, P. F., Pinter, G., Antretter, T. & Krivec, T., 2014, In: Circuit World. 40, p. 53-60Research output: Contribution to journal › Article › Research › peer-review
- Published
Microwave absorption and its thermo-mechanical consequences in heterogeneous rocks
Toifl, M., Meisels, R., Hartlieb, P., Kuchar, F. & Antretter, T., 2014.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Microwave absorption and its thermo-mechanical consequences in heterogeneous rocks
Toifl, M., Meisels, R., Hartlieb, P., Kuchar, F. & Antretter, T., 2014, Geomechanics from Micro to Macro. p. 1545-1550Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
