Thomas Antretter
Publications / Theses
- Published
Crystal orientation changes: a comparison of crystal plasticity finite element study and experimental results
Rehrl, C., Völker, B., Kleber, S., Antretter, T. & Pippan, R., 2012, In: Acta materialia. p. 2379-2386Research output: Contribution to journal › Article › Research › peer-review
- Published
An inverse finite element approach to calculate full-field forming strains
Ritt, R., Machado, M., Fischlschweiger, M., Major, Z. & Antretter, T., 2015, In: Key engineering materials. 651-653, p. 363 368 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Modelling of phase transformations and residual stress formation in hot-work tool steel components
Schemmel, M., Prevedel, P., Schöngrundner, R., Ecker, W. & Antretter, T., 2014, European Conference of Heat Treatment and 21st IFHTSE Congress. p. 285-292Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Prediction and Characterization of Residual Stresses after Heat Treatment of Massive Hot Work Tool Steel Components
Schemmel, M., Antretter, T., Ecker, W. & Prevedel, P., 19 Apr 2017.Research output: Contribution to conference › Presentation › Research › peer-review
- Published
Size effects in residual stress formation during quenching of cylinders made of hot-work tool steel
Schemmel, M., Prevedel, P., Schöngrundner, R., Ecker, W. & Antretter, T., 2015, In: Advances in Materials Science and Engineering. 7 p., 678056.Research output: Contribution to journal › Article › Research › peer-review
- Published
Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers Inc., 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., Dec 2022, In: Microelectronics Reliability. 139, 114799.Research output: Contribution to journal › Article › Research › peer-review
- Published
Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method
Schöngrundner, R., Treml, R., Antretter, T., Kozic, D., Ecker, W. & Kiener, D., 2014, In: Thin solid films. p. 321-330Research output: Contribution to journal › Article › Research › peer-review
- Published
Effect of back stress evolution due to martensitic transformation on iso-volume fraction lines in a Cr-Ni-Mo-Al-Ti maraging steel
Tanaka, K., Terasaki, T., Goto, S., Antretter, T., Fischer, F. D. & Cailletaud, G., 20 Jan 2003, In: Materials science and engineering: A, Structural materials: properties, microstructure and processing. 341, 1-2, p. 189-196 8 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Model Free Kinetics coupled with Finite Element Method for curing simulation of thermosetting epoxy resins
Tao, Q., Pinter, G. G., Antretter, T., Krivec, T. & Fuchs, P., 2018, In: Journal of Applied Polymer Science. p. 1-8Research output: Contribution to journal › Article › Research › peer-review
