Thomas Antretter
Publications / Theses
- Published
Solution of a time-dependent thermoelastic problem by an integral-equation approach
Leindl, M., Oberaigner, E. & Antretter, T., 2010, IWCMM20 - International Workshop on Computational Mechanics of Materials, Book of Abstracts. p. 50-50Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Solution of a time-dependent heat conduction problem by an integral-equation approach
Leindl, M., Oberaigner, E. & Antretter, T., 2011, In: Computational materials science. p. 178-181Research output: Contribution to journal › Article › Research › peer-review
- Published
Model-based residual stress design in multiphase seamless steel tubes
Leitner, S., Winter, G., Klarner, J., Antretter, T. & Ecker, W., 2020, In: Materials. 2020, 13, 439.Research output: Contribution to journal › Article › Research › peer-review
- E-pub ahead of print
Analysis of shape, orientation and interface properties of Mo2C precipitates in Fe using ab-initio and finite element method calculations
Leitner, S., Scheiber, D., Dengg, T., Spitaler, J., Antretter, T. & Ecker, W., 20 Nov 2020, (E-pub ahead of print) In: Acta materialia. 204.2021, 11 p., 116478.Research output: Contribution to journal › Article › Research › peer-review
- Published
Multi-physics simulation of the component attachment within embedding process
Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M. & Brizoux, M., 1 Apr 2013, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers Inc., p. 1-6 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process
Macurova, K., Bermejo Moratinos, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Jan 2014, Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. p. 355-360 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
Macurova, K., Angerer, P., Antretter, T., Bermejo Moratinos, R., Maia, W., Schöngrundner, R., Krivec, T., Morianz, M. & Brizoux, M., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Stress and Deflection Development During Die Embedding into Printed Circuit Boards
Macurova, K., Angerer, P., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 2015, In: Materials Today: Proceedings. 2, 2, p. 4196-4205 10 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process
Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R. & Antretter, T., 2015, In: Journal of Microelectronics and Electronic Packaging. 12, p. 80-85Research output: Contribution to journal › Article › Research › peer-review
- Published
Multi-scale modeling of bainitic phase transformation in multi-variant polycrystalline low alloy steels
Mahnken, R., Schneidt, A., Antretter, T., Ehlenbröker, U. & Wolff, M., 2015, In: International journal of solids and structures. 54, p. 156-171Research output: Contribution to journal › Article › Research › peer-review
