Jakub Zalesak

(Former)

Publications / Theses

  1. 2021
  2. Published

    Influence of Gradient Residual Stress and Tip Shape on Stress Fields Inside Indented TiN Hard Coating

    Todt, J., Zalesak, J., Krywka, C. & Keckes, J., 11 Jul 2021, In: Advanced Engineering Materials.

    Research output: Contribution to journalArticleResearchpeer-review

  3. Published

    Effect of high pressure torsion on crystallization and magnetic properties of Fe73.9Cu1Nb3Si15.5B6.6

    Antoni, M., Spieckermann, F., Soprunyuk, V., Chawake, N., Sarac, B., Zálešák, J., Polak, C., Gammer, C., Pippan, R., Zehetbauer, M. & Eckert, J., 1 May 2021, In: Journal of magnetism and magnetic materials. 525.2021, 1 May, 6 p., 167679.

    Research output: Contribution to journalArticleResearchpeer-review

  4. Published

    Effect of pressure and temperature on microstructure of self-assembled gradient AlxTi1−XN coatings

    Zalesak, J., Todt, J., Michalička, J., Sartory, B., Matko, I., Lessiak, M., Traxler, M., Weißenbacher, R., Pitonak, R., Gammer, C. & Keckes, J., 3 Apr 2021, In: Coatings. 11.2021, 4, 15 p., 416.

    Research output: Contribution to journalArticleResearchpeer-review

  5. Published

    Ion irradiation-induced localized stress relaxation in W thin film revealed by cross-sectional X-ray nanodiffraction

    Hlushko, K., Mackova, A., Zalesak, J., Burghammer, M., Davydok, A., Krywka, C., Daniel, R., Keckes, J. & Todt, J., 7 Feb 2021, In: Thin solid films. 722.2021, 31 March, 6 p., 138571.

    Research output: Contribution to journalArticleResearchpeer-review

  6. Published

    Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices

    Lassnig, A., Terziyska, V. L., Zalesak, J., Jörg, T., Toebbens, D. M., Griesser, T., Mitterer, C., Pippan, R. & Cordill, M. J., 22 Jan 2021, In: ACS Applied Nano Materials. 4, 1, p. 61-70 10 p.

    Research output: Contribution to journalArticleResearchpeer-review

  7. Published

    Microstructural effects on the interfacial adhesion of nanometer- thick Cu films on glass substrates: Implications for microelectronic devices

    Lassnig, A., Terziyska, V., Zalesak, J., Jörg, T., Többens, D., Griesser, T., Mitterer, C., Pippan, R. & Cordill, M., 2021, In: ACS Applied Nano Materials. 2021, 4, p. 61-70

    Research output: Contribution to journalArticleResearchpeer-review

  8. 2020
  9. Published

    Surface oxidation of nanocrystalline CVD TiB2 hard coatings revealed by cross-sectional nano-analytics and in-situ micro-cantilever testing

    Gruber, D. P., Zalesak, J., Todt, J., Tkadletz, M., Sartory, B., Suuronen, J. P., Ziegelwanger, T., Czettl, C., Mitterer, C. & Keckes, J., 20 Jul 2020, In: Surface and Coatings Technology. 399.2020, 15 October, 9 p., 126181.

    Research output: Contribution to journalArticleResearchpeer-review

  10. 2019
  11. Published

    Biomimetic hard and tough nanoceramic Ti–Al–N film with self-assembled six-level hierarchy

    Meindlhumer, M., Zalesak, J., Pitonak, R., Todt, J., Sartory, B., Burghammer, M., Stark, A., Schell, N., Daniel, R., Keckes, J., Lessiak, M., Köpf, A., Weißenbacher, R. & Keckes, J., 28 Apr 2019, In: Nanoscale. 11.2019, 16, p. 7986-7995 10 p.

    Research output: Contribution to journalArticleResearchpeer-review

  12. Published

    Anisotropy of fracture toughness in nanostructured ceramics controlled by grain boundary design

    Daniel, R., Meindlhumer, M., Baumegger, W., Todt, J., Zalesak, J., Ziegelwanger, T., Mitterer, C. & Keckes, J., 2019, In: Materials and Design. 161.2019, January, p. 80-85 6 p.

    Research output: Contribution to journalArticleResearchpeer-review

  13. 2018
  14. Published

    30 nm X-ray focusing correlates oscillatory stress, texture and structural defect gradients across multilayered Ti N-SiOx thin film

    Keckes, J., Daniel, R., Todt, J., Zalesak, J., Sartory, B., Braun, S., Gluch, J., Rosenthal, M., Burghammer, M. C., Mitterer, C., Niese, S. & Kubec, A., 2018, In: Acta materialia. 144, p. 862-873

    Research output: Contribution to journalArticleResearchpeer-review

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