Publications / Theses

1 - 10 out of 114Page size: 10

Sort by: Publication date

2024
Published
Unraveling mudstone compaction at microscale: A combined approach of nanoindentation mapping and machine learning data analysis
Shi, X., Misch, D., Skerbisch, L., Sachsenhofer, R. F., Zak, S., Cordill, M. & Kiener, D., Nov 2024, In: Marine and petroleum geology. 169, 107083.
Research output: Contribution to journal › Article › Research › peer-review
2023
Published
Rejuvenation engineering in metallic glasses by complementary stress and structure modulation
Şopu, D., Spieckermann, F., Bian, X., Fellner, S., Wright, J., Cordill, M., Gammer, C., Wang, G., Stoica, M. & Eckert, J., 24 Nov 2023, In: NPG Asia Materials.
Research output: Contribution to journal › Article › Research › peer-review
Published
How tight are top seals? Insights from a comprehensive characterization workflow
Shi, X., Misch, D., Cordill, M., Zak, S., Siedl, W., Sachsenhofer, R. & Kiener, D., 2023, 84th EAGE Annual Conference and Exhibition. p. 232-236 5 p. (84th EAGE Annual Conference and Exhibition; vol. 1).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2021
Published
Self-Reducing Silver Ink on Polyurethane Elastomers for the Manufacture of Thin and Highly Stretchable Electrical Circuits
Krawczyk, K. K., Groten, J., Glushko, O., Krivec, M., Frühwirth, M., Schulz, G., Wolf, C., Hartmann, D., Moser, M., Cordill, M. J., Stadlober, B. & Griesser, T., 27 Apr 2021, In: Chemistry of materials. 33, 8
Research output: Contribution to journal › Article › Research › peer-review
Published
Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices
Lassnig, A., Terziyska, V. L., Zalesak, J., Jörg, T., Toebbens, D. M., Griesser, T., Mitterer, C., Pippan, R. & Cordill, M. J., 22 Jan 2021, In: ACS Applied Nano Materials. 4, 1, p. 61-70 10 p.
Research output: Contribution to journal › Article › Research › peer-review
Published
Microstructural effects on the interfacial adhesion of nanometer- thick Cu films on glass substrates: Implications for microelectronic devices
Lassnig, A., Terziyska, V., Zalesak, J., Jörg, T., Többens, D., Griesser, T., Mitterer, C., Pippan, R. & Cordill, M., 2021, In: ACS Applied Nano Materials. 2021, 4, p. 61-70
Research output: Contribution to journal › Article › Research › peer-review
2020
Published
Sputter deposition of NiW films from a rotatable target
Rausch, M., Golizadeh Najafabadi, M., Kreiml, P., Cordill, M., Winkler, J. & Mitterer, C., 2020, In: Applied surface science. p. 145616 1-7
Research output: Contribution to journal › Article › Research › peer-review
2019
Published
Correlation of mechanical damage and electrical behavior of Al/Mo bilayers subjected to bending
Kreiml, P., Rausch, M., Terziyska, V. L., Köstenbauer, H., Winkler, J., Mitterer, C. & Cordill, M. J., 1 Oct 2019, In: Thin solid films. 687, 137480.
Research output: Contribution to journal › Article › Research › peer-review
Published
Compressive and tensile bending of sputter deposited Al/Mo bilayers
Kreiml, P., Rausch, M., Terziyska, V., Winkler, J., Mitterer, C. & Cordill, M., 15 Mar 2019, In: Scripta materialia. 162.2019, March, p. 367-371 5 p.
Research output: Contribution to journal › Article › Research › peer-review
2018
E-pub ahead of print
In-situ observations of the fracture and adhesion of Cu/Nb multilayers on polyimide substrates
Cordill, M., Kleinbichler, A., Völker, B., Kraker, P., Economy, D. R., Többens, D. M., Kirchlechner, C. & Kennedy, M. S., 14 Aug 2018, (E-pub ahead of print) In: Materials science and engineering: A, Structural materials: properties, microstructure and processing. 735.2018, 26 September, p. 456-462 7 p.
Research output: Contribution to journal › Article › Research › peer-review

Previous 1 2 3 4 5 6 7 8 ...12 Next

University of Leoben research gateway