By the same authors

• Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers

  Research output: Contribution to conference › Presentation › Research

• Microstructure and physical properties of sputter-deposited Cu-Mo thin films

  Research output: Contribution to journal › Article › Research › peer-review

• Molecular coverage determines sliding wear behavior of n ‐ octadecylphosphonic acid functionalized Cu – O coated steel disks against aluminum

  Research output: Contribution to journal › Article › Research › peer-review

• Effect of growth conditions on stress, texture, roughness and self-annealing behavior of sputter deposited Cu films

  Research output: Contribution to conference › Poster › Research › peer-review

• Adhesion evaluation of thin films to dielectrics in multilayer stacks: A comparison of four-point bending and stressed overlayer technique.

  Research output: Contribution to journal › Article › Research › peer-review