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• Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers

  Publikationen: Konferenzbeitrag › Vortrag › Forschung

• Microstructure and physical properties of sputter-deposited Cu-Mo thin films

  Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

• Molecular coverage determines sliding wear behavior of n ‐ octadecylphosphonic acid functionalized Cu – O coated steel disks against aluminum

  Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

• Effect of growth conditions on stress, texture, roughness and self-annealing behavior of sputter deposited Cu films

  Publikationen: Konferenzbeitrag › Poster › Forschung › (peer-reviewed)

• Adhesion evaluation of thin films to dielectrics in multilayer stacks: A comparison of four-point bending and stressed overlayer technique.

  Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)