Thomas Antretter

Publications / Theses

  1. Published

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers Inc., 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  2. Published

    Relaxation of a Precipitate Misfit Stress State by Creep in the Matrix

    Fischer, F. D., Svoboda, J., Antretter, T. & Kozeschnik, E., 2015, In: International journal of plasticity. 64, p. 164-176

    Research output: Contribution to journalArticleResearchpeer-review

  3. Published
  4. Published

    Residual Stress Investigations in Thin Film Systems: Experiment and Simulation

    Kozic, D., Treml, R., Sartory, B., Schöngrundner, R., Kiener, D., Antretter, T., Gänser, H.-P. & Brunner, R., 2014.

    Research output: Contribution to conferencePosterResearchpeer-review

  5. Published
  6. Published

    Simulation der Lagerverluste in Großmotoren und deren Validierung

    Antretter, T. (Reviewer), 2012, Graz : Eigenverlag.

    Research output: Other contributionTransferpeer-review

  7. Published

    Simulation des thermomechanischen Verhaltens von Grobblechen während der Schnellkühlung

    Eßl, W., Antretter, T. & Parteder, E., 2015.

    Research output: Contribution to conferencePresentationResearchpeer-review

  8. Published

    Simulation of Phase Transformation and Material Plasticity for Press Hardening

    Tomasch, M., Ecker, W. & Antretter, T., 2019, Proceedings of NUMIFORM 2019: the 13th International Conference on Numerical Methods in Industrial Forming Processes. p. 362-365

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  9. Published

    Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards

    Macurova, K., Angerer, P., Antretter, T., Bermejo Moratinos, R., Maia, W., Schöngrundner, R., Krivec, T., Morianz, M. & Brizoux, M., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  10. Published

    Simulation of the Damping of a Shape Memory Alloy Rod by using the Likhachev Model

    Pushtshaenko, O., Oberaigner, E., Antretter, T., Fischer, F. D. & Tanaka, K., 2002, In: Journal of intelligent material systems and structures. 13, p. 817-823

    Research output: Contribution to journalArticleResearchpeer-review