Thin solid films, ‎0040-6090

Journal

ISSNs0040-6090
11 - 20 out of 76Page size: 10

Publications / Theses

  1. 2018
  2. Published

    Effects of bias pulse frequencies on reactively sputter deposited NbOx films

    Lorenz, R., O`Sullivan, M., Fian, A., Sprenger, D., Lang, B. & Mitterer, C., 2018, In: Thin solid films. p. 335-342

    Research output: Contribution to journal › Article › Research › peer-review

  3. Published

    Electro-mechanical behavior of Al/Mo bilayers studied with in situ straining methods

    Kreiml, P., Rausch, M., Terziyska, V., Köstenbauer, H., Winkler, J., Mitterer, C. & Cordill, M., 2018, In: Thin solid films. p. 131-136

    Research output: Contribution to journal › Article › Research › peer-review

  4. Published

    Microstructure and physical properties of sputter-deposited Cu-Mo thin films

    Souli, I., Terziyska, V., Zechner, J. & Mitterer, C., 2018, In: Thin solid films. p. 301-308

    Research output: Contribution to journal › Article › Research › peer-review

  5. 2017
  6. Published

    Effect of annealing on the size dependent deformation behavior of thin cobalt films on flexible substrates

    Marx, V. M., Cordill, M., Többens, D., Kirchlechner, C. & Dehm, G., 2017, In: Thin solid films. 624, p. 34-40

    Research output: Contribution to journal › Article › Research › peer-review

  7. Published

    Microstructural influence on the cyclic electro-mechanical behaviour of ductile films on polymer substrates

    Cordill, M., Glushko, O., Kleinbichler, A., Putz, B., Többens, D. & Kirchlechner, C., 2017, In: Thin solid films. 644, p. 166-172

    Research output: Contribution to journal › Article › Research › peer-review

  8. 2016
  9. Published

    Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations

    Bigl, S., Wurster, S., Cordill, M. J. & Kiener, D., 1 Aug 2016, In: Thin solid films. 612, p. 153-164 12 p.

    Research output: Contribution to journal › Article › Research › peer-review

  10. Published

    Structure and properties of sputter deposited crystalline and amorphous Cu-Ti films

    Turnow, H., Wendrock, H., Menzel, S., Gemming, T. & Eckert, J., 1 Jan 2016, In: Thin solid films. 598, p. 184-188 5 p.

    Research output: Contribution to journal › Article › Research › peer-review

  11. Published

    Improvement of oxidation and corrosion resistance of Mo thin films by alloying with Ta

    Hofer-Roblyek, A. M., Mori, G., Fian, A., Winkler, J. & Mitterer, C., 2016, In: Thin solid films. 599, p. 1-6 6 p.

    Research output: Contribution to journal › Article › Research › peer-review

  12. Published

    Influence of oxygen impurities on growth morphology, structure and mechanical properties of Ti–Al–N thin films

    Riedl, H., Munnik, F., Hutter, H., Mendez Martin, F., Kolozsvari, S., Bartosik, M., Mayrhofer, P. H., Koller, C. & Rachbauer, R., 2016, In: Thin solid films. 603, p. 39-49 10 p.

    Research output: Contribution to journal › Article › Research › peer-review

  13. Published

    The electro-mechanical behavior of sputter- deposited Mo thin films on flexible substrates

    Jörg, T., Cordill, M., Franz, R., Glushko, O., Winkler, J. & Mitterer, C., 2016, In: Thin solid films. 606, p. 45-50 6 p.

    Research output: Contribution to journal › Article › Research › peer-review

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