Copper/epoxy joints in printed circuit boards: Manufacturing and interfacial failure mechanisms
Research output: Contribution to journal › Review article › peer-review
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Copper/epoxy joints in printed circuit boards: Manufacturing and interfacial failure mechanisms. / Nothdurft, Philipp; Riess, Gisbert; Kern, Wolfgang.
In: Materials, Vol. 12, No. 3, 550, 12.02.2019.
In: Materials, Vol. 12, No. 3, 550, 12.02.2019.
Research output: Contribution to journal › Review article › peer-review
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Nothdurft P, Riess G, Kern W. Copper/epoxy joints in printed circuit boards: Manufacturing and interfacial failure mechanisms. Materials. 2019 Feb 12;12(3):550. doi: 10.3390/ma12030550
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Bibtex - Download
@article{abd101b5852b4c628e06e26a5fdf4f5e,
title = "Copper/epoxy joints in printed circuit boards: Manufacturing and interfacial failure mechanisms",
keywords = "Circuit boards, Copper/epoxy joints, Electronic industry, Failure analysis, Printed, State of the art",
author = "Philipp Nothdurft and Gisbert Riess and Wolfgang Kern",
year = "2019",
month = feb,
day = "12",
doi = "10.3390/ma12030550",
language = "English",
volume = "12",
journal = "Materials",
issn = "1996-1944",
publisher = "Multidisciplinary Digital Publishing Institute (MDPI)",
number = "3",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Copper/epoxy joints in printed circuit boards
T2 - Manufacturing and interfacial failure mechanisms
AU - Nothdurft, Philipp
AU - Riess, Gisbert
AU - Kern, Wolfgang
PY - 2019/2/12
Y1 - 2019/2/12
KW - Circuit boards
KW - Copper/epoxy joints
KW - Electronic industry
KW - Failure analysis
KW - Printed
KW - State of the art
UR - http://www.scopus.com/inward/record.url?scp=85061484759&partnerID=8YFLogxK
U2 - 10.3390/ma12030550
DO - 10.3390/ma12030550
M3 - Review article
AN - SCOPUS:85061484759
VL - 12
JO - Materials
JF - Materials
SN - 1996-1944
IS - 3
M1 - 550
ER -
