Thomas Antretter

Publications / Theses

  1. Published

    The relation of temperature, microwave absorbing properties and thermo - dynamic behavior of selected hard rocks

    Hartlieb, P., Toifl, M., Meisels, R., Antretter, T. & Kuchar, F., 11 Jun 2015, Physical Separation 15 - Proceedings.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  2. Published
  3. Published

    Thermo-physical properties of selected hard rocks and their relation to microwave-assisted comminution

    Hartlieb, P., Toifl, M., Kuchar, F., Meisels, R. & Antretter, T., 2016, In: Minerals engineering. 91.2016, p. 34 - 41 8 p.

    Research output: Contribution to journalArticleResearchpeer-review

  4. Published

    Finite element analysis of arbitrarily complex electronics devices

    Gschwandl, M., Fuchs, P., Fellner, K., Antretter, T., Krivec, T. & Tao, Q., 2016, Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016. p. 497-500

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  5. Published

    Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

    Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. G. & Novàk, P., 2018.

    Research output: Contribution to conferencePosterResearch

  6. Published

    Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

    Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. G. & Novàk, P., 2018, EMAP 2018 Conference Proceedings. 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  7. Published

    Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

    Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. & Novak, P., 5 Mar 2019, EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers Inc., 8660763. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  8. Published

    A Sequential Finite Volume Method / Finite Element Analysis of a Power Electronic Semiconductor Chip

    Gschwandl, M., Fuchs, P. F., Antretter, T., Pfost, M., Mitev, I., Tao, Q., Krivec, T., Schingale, A. & Decker, M., 2019, p. 1509-1514.

    Research output: Contribution to conferencePaperpeer-review

  9. Published
  10. Published

    CRYSTAL PLASTICITY AND THE MAXIMUM RATE OF DISSIPATION

    Gänser, H.-P., Antretter, T., Ecker, W. & Orthaber, M., 2012, Book of Abstracts of 10th World Congress on Computational Mechanics. p. 100-100

    Research output: Chapter in Book/Report/Conference proceedingConference contribution