Megan Cordill
(Former)
Publications / Theses
- 2017
- Published
The driving force governing room temperature grain coarsening in thin gold films
Glushko, O. & Cordill, M., 2017, In: Scripta Materialia. 130, p. 42-45Research output: Contribution to journal › Article › Research › peer-review
- Published
Thin Film Adhesion of Flexible Electronics Influenced by Interlayers
Kleinbichler, A., Bartosik, M., Völker, B. & Cordill, M. J., 2017, In: Advanced Engineering Materials. 19.2017, 4, 7 p., 1600665.Research output: Contribution to journal › Article › Research › peer-review
- 2016
- Published
Correlative microstructure and topography informed nanoindentation of copper films
Bigl, S., Schöberl, T., Wurster, S., Cordill, M. J. & Kiener, D., 25 Dec 2016, In: Surface & coatings technology. 308, p. 404-413 10 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Grain growth during cyclic straining of copper film revealed with in-situ resistance measurements
Cordill, M. & Glushko, O., 25 Oct 2016.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations
Bigl, S., Wurster, S., Cordill, M. J. & Kiener, D., 1 Aug 2016, In: Thin solid films. 612, p. 153-164 12 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Evaluating reliability of flexible electronic materials with combined electromechanical testing techniques
Cordill, M., 25 May 2016.Research output: Contribution to conference › Presentation › Research › peer-review
- Published
Examining nanoindentation imprints with in-situ AFM-SEM
Cordill, M., Kreith, J., Strunz, T. & Fantner, E. J., 30 Mar 2016.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Low cycle fatigue of Cu thin films: Novel approaches for thermomechanical testing & microstructural analysis
Bigl, S., Wurster, S., Cordill, M. J. & Kiener, D., 22 Mar 2016.Research output: Contribution to conference › Presentation › Research
- Published
33-2: Invited Paper: Evaluating Reliability of Flexible Electronic Materials with Combined Electro-Mechanical Testing Techniques
Cordill, M., Berger, J. & Jörg, T., 2016, Digest of technical papers / Society for Information Display, SID. (Digest of technical papers / Society for Information Display, SID).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Advanced Characterization of thermo-mechanical fatigue mechanisms for semiconductor metallizations
Bigl, S., Wurster, S., Schöberl, T., Cordill, M. & Kiener, D., 2016.Research output: Contribution to conference › Presentation › Research › peer-review
