Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics

Research output: Contribution to journal › Article › Research › peer-review

Standard

Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics. / Schipfer, Christian; Gschwandl, Mario; Fuchs, Peter et al.
In: Microelectronics Reliability, Vol. 139, 114799, 12.2022.

Research output: Contribution to journal › Article › Research › peer-review

Harvard

Schipfer, C, Gschwandl, M, Fuchs, P, Antretter, T, Feuchter, M, Morak, M, Tao, Q & Schingale, A 2022, 'Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics', Microelectronics Reliability, vol. 139, 114799. https://doi.org/10.1016/j.microrel.2022.114799

APA

Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q., & Schingale, A. (2022). Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics. Microelectronics Reliability, 139, Article 114799. https://doi.org/10.1016/j.microrel.2022.114799

Vancouver

Schipfer C, Gschwandl M, Fuchs P, Antretter T, Feuchter M, Morak M et al. Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics. Microelectronics Reliability. 2022 Dec;139:114799. doi: 10.1016/j.microrel.2022.114799

Author

Schipfer, Christian ; Gschwandl, Mario ; Fuchs, Peter et al. / Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics. In: Microelectronics Reliability. 2022 ; Vol. 139.

Bibtex - Download

@article{6a00112f77c34dc0adda260ea6c4fe09,
title = "Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics",
keywords = "Curing simulation, D2PAK, Finite-element-simulation, Heating cycle, Process optimization, Residual stresses",
author = "Christian Schipfer and Mario Gschwandl and Peter Fuchs and Thomas Antretter and Michael Feuchter and Matthias Morak and Qi Tao and Angelika Schingale",
note = "Publisher Copyright: {\textcopyright} 2022 Elsevier Ltd",
year = "2022",
month = dec,
doi = "10.1016/j.microrel.2022.114799",
language = "English",
volume = "139",
journal = "Microelectronics Reliability",
issn = "0026-2714",
publisher = "Elsevier",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics

AU - Schipfer, Christian

AU - Gschwandl, Mario

AU - Fuchs, Peter

AU - Antretter, Thomas

AU - Feuchter, Michael

AU - Morak, Matthias

AU - Tao, Qi

AU - Schingale, Angelika

N1 - Publisher Copyright: © 2022 Elsevier Ltd

PY - 2022/12

Y1 - 2022/12

KW - Curing simulation

KW - D2PAK

KW - Finite-element-simulation

KW - Heating cycle

KW - Process optimization

KW - Residual stresses

UR - http://www.scopus.com/inward/record.url?scp=85140025400&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2022.114799

DO - 10.1016/j.microrel.2022.114799

M3 - Article

AN - SCOPUS:85140025400

VL - 139

JO - Microelectronics Reliability

JF - Microelectronics Reliability

SN - 0026-2714

M1 - 114799

ER -

View graph of relations

SFX

Publication SFX

By the same authors

View more