Investigation of high cyclic fatigue behaviour of thin copper films using MEMS structure

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Investigation of high cyclic fatigue behaviour of thin copper films using MEMS structure. / Saghaeian, F.; Lederer, M.; Hofer, A. et al.
In: International Journal of Fatigue, Vol. 128, 105179, 01.11.2019.

Research output: Contribution to journal › Article › Research › peer-review

Harvard

Saghaeian, F, Lederer, M, Hofer, A, Todt, J, Keckes, J & Khatibi, G 2019, 'Investigation of high cyclic fatigue behaviour of thin copper films using MEMS structure', International Journal of Fatigue, vol. 128, 105179. https://doi.org/10.1016/j.ijfatigue.2019.06.039

APA

Saghaeian, F., Lederer, M., Hofer, A., Todt, J., Keckes, J., & Khatibi, G. (2019). Investigation of high cyclic fatigue behaviour of thin copper films using MEMS structure. International Journal of Fatigue, 128, Article 105179. https://doi.org/10.1016/j.ijfatigue.2019.06.039

Vancouver

Saghaeian F, Lederer M, Hofer A, Todt J, Keckes J, Khatibi G. Investigation of high cyclic fatigue behaviour of thin copper films using MEMS structure. International Journal of Fatigue. 2019 Nov 1;128:105179. doi: 10.1016/j.ijfatigue.2019.06.039

Author

Saghaeian, F. ; Lederer, M. ; Hofer, A. et al. / Investigation of high cyclic fatigue behaviour of thin copper films using MEMS structure. In: International Journal of Fatigue. 2019 ; Vol. 128.

Bibtex - Download

@article{1948eadd17344ee4a562ff58f577a268,
title = "Investigation of high cyclic fatigue behaviour of thin copper films using MEMS structure",
keywords = "Electronic material, High cycle fatigue, MEMS, Microstructures, Reliability",
author = "F. Saghaeian and M. Lederer and A. Hofer and J. Todt and J. Keckes and G. Khatibi",
year = "2019",
month = nov,
day = "1",
doi = "10.1016/j.ijfatigue.2019.06.039",
language = "English",
volume = "128",
journal = "International Journal of Fatigue",
issn = "0142-1123",
publisher = "Elsevier",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Investigation of high cyclic fatigue behaviour of thin copper films using MEMS structure

AU - Saghaeian, F.

AU - Lederer, M.

AU - Hofer, A.

AU - Todt, J.

AU - Keckes, J.

AU - Khatibi, G.

PY - 2019/11/1

Y1 - 2019/11/1

KW - Electronic material

KW - High cycle fatigue

KW - MEMS

KW - Microstructures

KW - Reliability

UR - http://www.scopus.com/inward/record.url?scp=85068418395&partnerID=8YFLogxK

U2 - 10.1016/j.ijfatigue.2019.06.039

DO - 10.1016/j.ijfatigue.2019.06.039

M3 - Article

AN - SCOPUS:85068418395

VL - 128

JO - International Journal of Fatigue

JF - International Journal of Fatigue

SN - 0142-1123

M1 - 105179

ER -

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