Influence of cooling rate and annealing on the DSC Tg of an epoxy resin
Research output: Contribution to journal › Article › Research › peer-review
Standard
Influence of cooling rate and annealing on the DSC Tg of an epoxy resin. / Tao, Qi; Pinter, Gerald; Krivec, Thomas.
In: Microelectronics Reliability, Vol. 78, 01.11.2017, p. 396-400.
In: Microelectronics Reliability, Vol. 78, 01.11.2017, p. 396-400.
Research output: Contribution to journal › Article › Research › peer-review
Harvard
Tao, Q, Pinter, G & Krivec, T 2017, 'Influence of cooling rate and annealing on the DSC Tg of an epoxy resin', Microelectronics Reliability, vol. 78, pp. 396-400. https://doi.org/10.1016/j.microrel.2017.07.088
APA
Tao, Q., Pinter, G., & Krivec, T. (2017). Influence of cooling rate and annealing on the DSC Tg of an epoxy resin. Microelectronics Reliability, 78, 396-400. https://doi.org/10.1016/j.microrel.2017.07.088
Vancouver
Tao Q, Pinter G, Krivec T. Influence of cooling rate and annealing on the DSC Tg of an epoxy resin. Microelectronics Reliability. 2017 Nov 1;78:396-400. doi: 10.1016/j.microrel.2017.07.088
Author
Bibtex - Download
@article{de6c1654ee1e4acc99462d8adf72eb97,
title = "Influence of cooling rate and annealing on the DSC Tg of an epoxy resin",
keywords = "Annealing, Cooling rate, Curing pressure, Endothermic peak, Epoxy resin, Glass transition",
author = "Qi Tao and Gerald Pinter and Thomas Krivec",
year = "2017",
month = nov,
day = "1",
doi = "10.1016/j.microrel.2017.07.088",
language = "English",
volume = "78",
pages = "396--400",
journal = "Microelectronics Reliability",
issn = "0026-2714",
publisher = "Elsevier",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Influence of cooling rate and annealing on the DSC Tg of an epoxy resin
AU - Tao, Qi
AU - Pinter, Gerald
AU - Krivec, Thomas
PY - 2017/11/1
Y1 - 2017/11/1
KW - Annealing
KW - Cooling rate
KW - Curing pressure
KW - Endothermic peak
KW - Epoxy resin
KW - Glass transition
UR - http://www.scopus.com/inward/record.url?scp=85026224896&partnerID=8YFLogxK
U2 - 10.1016/j.microrel.2017.07.088
DO - 10.1016/j.microrel.2017.07.088
M3 - Article
AN - SCOPUS:85026224896
VL - 78
SP - 396
EP - 400
JO - Microelectronics Reliability
JF - Microelectronics Reliability
SN - 0026-2714
ER -
