Grain boundary design of thin films: Using tilted brittle interfaces for multiple crack deflection toughening

Research output: Contribution to journal › Article › Research › peer-review

Standard

Grain boundary design of thin films: Using tilted brittle interfaces for multiple crack deflection toughening. / Daniel, Rostislav; Meindlhumer, Michael; Baumegger, Walter et al.
In: Acta materialia, Vol. 122, 2017, p. 130-137.

Research output: Contribution to journal › Article › Research › peer-review

Harvard

Daniel, R, Meindlhumer, M, Baumegger, W, Zalesak, J, Sartory, B, Burghammer, M, Mitterer, C & Keckes, J 2017, 'Grain boundary design of thin films: Using tilted brittle interfaces for multiple crack deflection toughening', Acta materialia, vol. 122, pp. 130-137. https://doi.org/10.1016/j.actamat.2016.09.027

APA

Daniel, R., Meindlhumer, M., Baumegger, W., Zalesak, J., Sartory, B., Burghammer, M., Mitterer, C., & Keckes, J. (2017). Grain boundary design of thin films: Using tilted brittle interfaces for multiple crack deflection toughening. Acta materialia, 122, 130-137. https://doi.org/10.1016/j.actamat.2016.09.027

Vancouver

Daniel R, Meindlhumer M, Baumegger W, Zalesak J, Sartory B, Burghammer M et al. Grain boundary design of thin films: Using tilted brittle interfaces for multiple crack deflection toughening. Acta materialia. 2017;122:130-137. doi: http://dx.doi.org/10.1016/j.actamat.2016.09.027

Author

Daniel, Rostislav ; Meindlhumer, Michael ; Baumegger, Walter et al. / Grain boundary design of thin films: Using tilted brittle interfaces for multiple crack deflection toughening. In: Acta materialia. 2017 ; Vol. 122. pp. 130-137.

Bibtex - Download

@article{c0b5f8a8cc8b4d0eaf29e1ef4adbe40d,
title = "Grain boundary design of thin films: Using tilted brittle interfaces for multiple crack deflection toughening",
keywords = "Nanostructured hierarchical materials, Microstructure design, Enhanced fracture toughness, Micromechanical testing",
author = "Rostislav Daniel and Michael Meindlhumer and Walter Baumegger and Jakub Zalesak and Bernhard Sartory and Manfred Burghammer and Christian Mitterer and Jozef Keckes",
year = "2017",
doi = "http://dx.doi.org/10.1016/j.actamat.2016.09.027",
language = "English",
volume = "122",
pages = "130--137",
journal = "Acta materialia",
issn = "1359-6454",
publisher = "Elsevier",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Grain boundary design of thin films: Using tilted brittle interfaces for multiple crack deflection toughening

AU - Daniel, Rostislav

AU - Meindlhumer, Michael

AU - Baumegger, Walter

AU - Zalesak, Jakub

AU - Sartory, Bernhard

AU - Burghammer, Manfred

AU - Mitterer, Christian

AU - Keckes, Jozef

PY - 2017

Y1 - 2017

KW - Nanostructured hierarchical materials

KW - Microstructure design

KW - Enhanced fracture toughness

KW - Micromechanical testing

U2 - http://dx.doi.org/10.1016/j.actamat.2016.09.027

DO - http://dx.doi.org/10.1016/j.actamat.2016.09.027

M3 - Article

VL - 122

SP - 130

EP - 137

JO - Acta materialia

JF - Acta materialia

SN - 1359-6454

ER -

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