Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue

Research output: Contribution to journal › Article › Research › peer-review

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Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue. / Bigl, Stephan; Trost, Claus O.W.; Wurster, Stefan et al.
In: Journal of materials research (JMR), Vol. 32, No. 11, 14.06.2017, p. 2022-2034.

Research output: Contribution to journal › Article › Research › peer-review

Harvard

Bigl, S, Trost, COW, Wurster, S, Cordill, MJ & Kiener, D 2017, 'Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue', Journal of materials research (JMR), vol. 32, no. 11, pp. 2022-2034. https://doi.org/10.1557/jmr.2017.199

APA

Bigl, S., Trost, C. O. W., Wurster, S., Cordill, M. J., & Kiener, D. (2017). Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue. Journal of materials research (JMR), 32(11), 2022-2034. https://doi.org/10.1557/jmr.2017.199

Vancouver

Bigl S, Trost COW, Wurster S, Cordill MJ, Kiener D. Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue. Journal of materials research (JMR). 2017 Jun 14;32(11):2022-2034. doi: 10.1557/jmr.2017.199

Author

Bigl, Stephan ; Trost, Claus O.W. ; Wurster, Stefan et al. / Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue. In: Journal of materials research (JMR). 2017 ; Vol. 32, No. 11. pp. 2022-2034.

Bibtex - Download

@article{846321e4e74f41c284427b5e03144efb,
title = "Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue",
keywords = "fatigue, texture, thermal stresses",
author = "Stephan Bigl and Trost, {Claus O.W.} and Stefan Wurster and Cordill, {Megan J.} and Daniel Kiener",
year = "2017",
month = jun,
day = "14",
doi = "10.1557/jmr.2017.199",
language = "English",
volume = "32",
pages = "2022--2034",
journal = "Journal of materials research (JMR)",
issn = "0884-2914",
publisher = "Materials Research Society : MRS",
number = "11",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue

AU - Bigl, Stephan

AU - Trost, Claus O.W.

AU - Wurster, Stefan

AU - Cordill, Megan J.

AU - Kiener, Daniel

PY - 2017/6/14

Y1 - 2017/6/14

KW - fatigue

KW - texture

KW - thermal stresses

UR - http://www.scopus.com/inward/record.url?scp=85020723130&partnerID=8YFLogxK

U2 - 10.1557/jmr.2017.199

DO - 10.1557/jmr.2017.199

M3 - Article

AN - SCOPUS:85020723130

VL - 32

SP - 2022

EP - 2034

JO - Journal of materials research (JMR)

JF - Journal of materials research (JMR)

SN - 0884-2914

IS - 11

ER -

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