Martin Pletz
Publications / Theses
- 2013
- Published
A new roughness parameter to evaluate the near-surface deformation in dry rolling/sliding contact
Kubin, W. K., Pletz, M., Daves, W. & Scheriau, S., 2013, In: Tribology International. 67, p. 132-139Research output: Contribution to journal › Article › Research › peer-review
- 2012
- Published
A Wheel Passing a Crossing Nose- Dynamic Analysis under High Axle Loads using Finite Element Modelling
Pletz, M., Daves, W. & Ossberger, H., 10 Oct 2012, In: Proceedings of the Institution of Mechanical Engineers. Part F, Journal of rail and rapid transit. 226, 6, p. 603-611 9 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
A wheel set/crossing model regarding impact, sliding and deformation-Explicit finite element approach: Wear
Pletz, M., Daves, W. & Ossberger, H., 2012, In: Wear. 294-295, p. 446-456 11 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Damage in Railway Crossings - Numerical Models
Pletz, M., 2012Research output: Thesis › Doctoral Thesis
- Published
Influence of deposited metal structures on the failure mechanisms of silicon-based components
Deluca, M., Bermejo Moratinos, R., Pletz, M., Wießner, M., Supancic, P. & Danzer, R., 2012, In: Journal of the European Ceramic Society. 32, p. 4371-4380Research output: Contribution to journal › Article › Research › peer-review
- 2011
- Published
Local strength measurement technique for miniaturised silicon-based components
Deluca, M., Pletz, M., Morianz, M., Stahr, J., Supancic, P., Danzer, R. & Bermejo, R., 2011, 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. 5765812Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Numerical investigation of the process of embedding components into printed circuit boards
Pletz, M., Bermejo, R., Supancic, P., Stahr, J. & Morianz, M., 2011, 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. 5765814Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Strength and fracture analysis of silicon-based components for embedding
Deluca, M., Bermejo Moratinos, R., Pletz, M., Supancic, P. & Danzer, R., 2011, In: Journal of the European Ceramic Society. 31, p. 549-558Research output: Contribution to journal › Article › Research › peer-review
- 2010
- Published
Characterisation and modelling of the mechanical reliability of semiconductor components for Printed Circuit Boards
Bermejo Moratinos, R., Deluca, M., pletz, M., Supancic, P. & Danzer, R., 2010.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Strength and fracture analysis of silicon chips to be embedded into printed circuit boards
Deluca, M., Bermejo, R., Pletz, M. & Supancic, P., 2010, 18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution