Powder diffraction, ‎0885-7156

Journal

ISSNs0885-7156
1 - 5 out of 5Page size: 10

Publications / Theses

  1. 2016
  2. Published

    Curvature determination of embedded silicon chips by in situ rocking curve X-ray diffraction measurements at elevated temperatures

    Angerer, P., Schöngrundner, R., Macurova, K., Wiessner, M. & Keckes, J., 1 Dec 2016, In: Powder diffraction. 31, 4, p. 267-273 7 p.

    Research output: Contribution to journal › Article › Research › peer-review

  3. 2006
  4. Published

    Combined elastic strain and macroscopic stress characterization in polycrystalline Cu thin films

    Eiper, E., Martinschitz, K-J. & Keckes, J., 2006, In: Powder diffraction. 21, p. 25-29

    Research output: Contribution to journal › Article › Research › peer-review

  5. 2005
  6. Published

    Combined elastic strain and macroscopic stress characterization in polycrystalline Cu thin films

    Eiper, E., Martinschitz, K-J. & Keckes, J., 2005, In: Powder diffraction. 20, p. 1-5

    Research output: Contribution to journal › Article › Research › peer-review

  7. 2004
  8. Published

    Evaluation of experimental stress-strain dependence in thermally cycled Al thin film on Si(100)

    Keckes, J., Hafok, M., Eiper, E., Hofer, A., Resel, R. & Eisenmenger-Sittner, C., 2004, In: Powder diffraction. 19, p. 367-371

    Research output: Contribution to journal › Article › Research › peer-review

  9. Published

    Thermally-induced stresses in thin aluminum layers grown on silicon

    Eiper, E., Resel, R., Eisenmenger-Sittner, C., Hafok, M. & Keckes, J., 2004, In: Powder diffraction. p. 74-76

    Research output: Contribution to journal › Article › Research › peer-review

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