Microstructural effects on the interfacial adhesion of nanometer- thick Cu films on glass substrates: Implications for microelectronic devices
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Standard
Microstructural effects on the interfacial adhesion of nanometer- thick Cu films on glass substrates: Implications for microelectronic devices. / Lassnig, A.; Terziyska, Velislava; Zalesak, Jakub et al.
in: ACS Applied Nano Materials, Jahrgang 2021, Nr. 4, 2021, S. 61-70.
in: ACS Applied Nano Materials, Jahrgang 2021, Nr. 4, 2021, S. 61-70.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Harvard
Lassnig, A, Terziyska, V, Zalesak, J, Jörg, T, Többens, D, Griesser, T, Mitterer, C, Pippan, R & Cordill, M 2021, 'Microstructural effects on the interfacial adhesion of nanometer- thick Cu films on glass substrates: Implications for microelectronic devices', ACS Applied Nano Materials, Jg. 2021, Nr. 4, S. 61-70. https://doi.org/10.1021/acsanm.0c02182
APA
Lassnig, A., Terziyska, V., Zalesak, J., Jörg, T., Többens, D., Griesser, T., Mitterer, C., Pippan, R., & Cordill, M. (2021). Microstructural effects on the interfacial adhesion of nanometer- thick Cu films on glass substrates: Implications for microelectronic devices. ACS Applied Nano Materials, 2021(4), 61-70. https://doi.org/10.1021/acsanm.0c02182
Vancouver
Lassnig A, Terziyska V, Zalesak J, Jörg T, Többens D, Griesser T et al. Microstructural effects on the interfacial adhesion of nanometer- thick Cu films on glass substrates: Implications for microelectronic devices. ACS Applied Nano Materials. 2021;2021(4):61-70. doi: 10.1021/acsanm.0c02182
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Bibtex - Download
@article{cfb13d8e5c454299acc2ac1ffabbf3d5,
title = "Microstructural effects on the interfacial adhesion of nanometer- thick Cu films on glass substrates: Implications for microelectronic devices",
author = "A. Lassnig and Velislava Terziyska and Jakub Zalesak and Tanja J{\"o}rg and Daniel T{\"o}bbens and Thomas Griesser and Christian Mitterer and Reinhard Pippan and Megan Cordill",
year = "2021",
doi = "10.1021/acsanm.0c02182",
language = "English",
volume = "2021",
pages = "61--70",
journal = "ACS Applied Nano Materials",
issn = "2574-0970",
publisher = "American Chemical Society",
number = "4",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Microstructural effects on the interfacial adhesion of nanometer- thick Cu films on glass substrates: Implications for microelectronic devices
AU - Lassnig, A.
AU - Terziyska, Velislava
AU - Zalesak, Jakub
AU - Jörg, Tanja
AU - Többens, Daniel
AU - Griesser, Thomas
AU - Mitterer, Christian
AU - Pippan, Reinhard
AU - Cordill, Megan
PY - 2021
Y1 - 2021
U2 - 10.1021/acsanm.0c02182
DO - 10.1021/acsanm.0c02182
M3 - Article
VL - 2021
SP - 61
EP - 70
JO - ACS Applied Nano Materials
JF - ACS Applied Nano Materials
SN - 2574-0970
IS - 4
ER -
