Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Standard
Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers. / Souli, Imane; Terziyska, Velislava; Keckes, Jozef et al.
in: Journal of vacuum science & technology / B (JVST), Jahrgang 35, 2017, S. 022201-1 - 022201-11.
in: Journal of vacuum science & technology / B (JVST), Jahrgang 35, 2017, S. 022201-1 - 022201-11.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Harvard
Souli, I, Terziyska, V, Keckes, J, Robl, W, Zechner, J & Mitterer, C 2017, 'Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers', Journal of vacuum science & technology / B (JVST), Jg. 35, S. 022201-1 - 022201-11. https://doi.org/10.1116/1.4975805
APA
Souli, I., Terziyska, V., Keckes, J., Robl, W., Zechner, J., & Mitterer, C. (2017). Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers. Journal of vacuum science & technology / B (JVST), 35, 022201-1 - 022201-11. https://doi.org/10.1116/1.4975805
Vancouver
Souli I, Terziyska V, Keckes J, Robl W, Zechner J, Mitterer C. Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers. Journal of vacuum science & technology / B (JVST). 2017;35:022201-1 - 022201-11. doi: http://dx.doi.org/10.1116/1.4975805
Author
Bibtex - Download
@article{4d888197264c4fe899b2576e0c8a95a3,
title = "Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers",
author = "Imane Souli and Velislava Terziyska and Jozef Keckes and W. Robl and J. Zechner and Christian Mitterer",
year = "2017",
doi = "http://dx.doi.org/10.1116/1.4975805",
language = "English",
volume = "35",
pages = "022201--1 -- 022201--11",
journal = "Journal of vacuum science & technology / B (JVST)",
issn = "1071-1023",
publisher = "AVS Science and Technology Society",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers
AU - Souli, Imane
AU - Terziyska, Velislava
AU - Keckes, Jozef
AU - Robl, W.
AU - Zechner, J.
AU - Mitterer, Christian
PY - 2017
Y1 - 2017
U2 - http://dx.doi.org/10.1116/1.4975805
DO - http://dx.doi.org/10.1116/1.4975805
M3 - Article
VL - 35
SP - 022201-1 - 022201-11
JO - Journal of vacuum science & technology / B (JVST)
JF - Journal of vacuum science & technology / B (JVST)
SN - 1071-1023
ER -
