Michael Reisinger
(Ehemalig)
Neuester Forschungsoutput
Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Microstructure and stress gradients in TiW thin films characterized by 40 nm X-ray diffraction and transmission electron microscopy
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Resolving alternating stress gradients and dislocation densities across AlxGa1-xN multilayer structures on Si(111)
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)