Ion irradiation-induced localized stress relaxation in W thin film revealed by cross-sectional X-ray nanodiffraction

Hlushko, K., Mackova, A., Zalesak, J., Burghammer, M., Davydok, A., Krywka, C., Daniel, R., Keckes, J. & Todt, J., 7 Feb. 2021, in: Thin solid films. 722.2021, 31 March, 6 S., 138571.

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Improved electro-mechanical reliability of flexible systems with alloyed Mo-Ta adhesion layers

Kreiml, P., Rausch, M., Terziyska, V., Köstenbauer, H., Winkler, J., Mitterer, C. & Cordill, M. J., 9 Jan. 2021, (Elektronische Veröffentlichung vor Drucklegung.) in: Thin solid films. 720.2021, 28 February, 9 S., 138533.

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Mechanical properties of homogeneous and nitrogen graded TiN thin films

Silva, F. C., Tunes, M. A., Sagás, J. C., Fontana, L. C., de Lima, N. B. & Schön, C. G., 30 Sept. 2020, in: Thin solid films. 710, S. 138268 1 S., 138268.

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Microstructure and stress gradients in TiW thin films characterized by 40 nm X-ray diffraction and transmission electron microscopy

Saghaeian, F., Keckes, J., Woehlert, S., Rosenthal, M., Reisinger, M. & Todt, J., 1 Dez. 2019, in: Thin solid films. 691, 137576.

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The effect of B and C addition on microstructure and mechanical properties of TiN hard coatings grown by chemical vapor deposition

Kainz, C., Schalk, N., Tkadletz, M., Mitterer, C. & Czettl, C., 31 Okt. 2019, in: Thin solid films. 688.2019, 137283, 8 S., 137283.

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Thermal expansion of magnetron sputtered TiC_xN_1-x coatings studied by high-temperature X-ray diffraction

Saringer, C., Kickinger, C., Munnik, F., Mitterer, C., Schalk, N. & Tkadletz, M., 31 Okt. 2019, in: Thin solid films. 688, 137307.

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Correlation of mechanical damage and electrical behavior of Al/Mo bilayers subjected to bending

Kreiml, P., Rausch, M., Terziyska, V. L., Köstenbauer, H., Winkler, J., Mitterer, C. & Cordill, M. J., 1 Okt. 2019, in: Thin solid films. 687, 137480.

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Crack arrest in thin metallic film stacks due to material- and residual stress inhomogeneities

Kozic, D., Gänser, H.-P., Brunner, R., Kiener, D., Antretter, T. & Kolednik, O., 31 Dez. 2018, in: Thin solid films. S. 14-22 9 S.

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Recent developments in surface science and engineering, thin films, nanoscience, biomaterials, plasma science, and vacuum technology

Mozetic, M., Vesel, A., Primc, G., Eisenmenger-Sittner, C., Bauer, J., Eder, A., Schmid, G. H. S., Ruzic, D. N., Ahmed, Z., Barker, D., Douglass, K. O., Eckel, S., Fedchak, J. A., Hendricks, J., Klimov, N., Ricker, J., Scherschligt, J., Stone, J., Strouse, G. & Capan, I. &31 mehr, Buljan, M., Milosevic, S., Teichert, C., Cohen, S. R., Silva, A. G., Lehocky, M., Humpolicek, P., Rodriguez, C., Hernandez-Montelongo, J., Mercier, D., Manso-Silvan, M., Ceccone, G., Galtayries, A., Stana-Kleinschek, K., Petrov, I., Greene, J. E., Avila, J., Chen, C. Y., Caja-Munoz, B., Yi, H., Boury, A., Lorcy, S., Asensio, M. C., Bredin, J., Gans, T., O'Connell, D., Brendin, J., Reniers, F., Vincze, A., Anderle, M. & Montelius, L., 30 Aug. 2018, in: Thin solid films. 660, S. 120-160

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Effects of bias pulse frequencies on reactively sputter deposited NbO_x films

Lorenz, R., O`Sullivan, M., Fian, A., Sprenger, D., Lang, B. & Mitterer, C., 2018, in: Thin solid films. S. 335-342

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Electro-mechanical behavior of Al/Mo bilayers studied with in situ straining methods

Kreiml, P., Rausch, M., Terziyska, V., Köstenbauer, H., Winkler, J., Mitterer, C. & Cordill, M., 2018, in: Thin solid films. S. 131-136

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Microstructure and physical properties of sputter-deposited Cu-Mo thin films

Souli, I., Terziyska, V., Zechner, J. & Mitterer, C., 2018, in: Thin solid films. S. 301-308

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Effect of annealing on the size dependent deformation behavior of thin cobalt films on flexible substrates

Marx, V. M., Cordill, M., Többens, D., Kirchlechner, C. & Dehm, G., 2017, in: Thin solid films. 624, S. 34-40

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Microstructural influence on the cyclic electro-mechanical behaviour of ductile films on polymer substrates

Cordill, M., Glushko, O., Kleinbichler, A., Putz, B., Többens, D. & Kirchlechner, C., 2017, in: Thin solid films. 644, S. 166-172

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Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations

Bigl, S., Wurster, S., Cordill, M. J. & Kiener, D., 1 Aug. 2016, in: Thin solid films. 612, S. 153-164 12 S.

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Structure and properties of sputter deposited crystalline and amorphous Cu-Ti films

Turnow, H., Wendrock, H., Menzel, S., Gemming, T. & Eckert, J., 1 Jan. 2016, in: Thin solid films. 598, S. 184-188 5 S.

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Improvement of oxidation and corrosion resistance of Mo thin films by alloying with Ta

Hofer-Roblyek, A. M., Mori, G., Fian, A., Winkler, J. & Mitterer, C., 2016, in: Thin solid films. 599, S. 1-6 6 S.

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Influence of oxygen impurities on growth morphology, structure and mechanical properties of Ti–Al–N thin films

Riedl, H., Munnik, F., Hutter, H., Mendez Martin, F., Kolozsvari, S., Bartosik, M., Mayrhofer, P. H., Koller, C. & Rachbauer, R., 2016, in: Thin solid films. 603, S. 39-49 10 S.

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The electro-mechanical behavior of sputter- deposited Mo thin films on flexible substrates

Jörg, T., Cordill, M., Franz, R., Glushko, O., Winkler, J. & Mitterer, C., 2016, in: Thin solid films. 606, S. 45-50 6 S.

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